Speeding Edge Digital Library
This new product, the Speeding Edge Digital Library, contains an extensive collection of highly relevant technical articles that provide more current information on design issues of concern. Provided on CD-ROM, these articles essentially comprise an addendum to our two books, “Right The First Time, Volumes 1 and 2.” Given the changes that have arisen since we published our two books, the Digital Library addresses many questions and issues of concern relative to Power Delivery and Differential Signaling. The Library has been developed in response to requests made during our training courses, consulting efforts and other frequently asked questions. Many of the articles contained within the Speeding Edge Digital Library have been written by Speeding Edge founder and president, Lee Ritchey. Additional articles written by other experts in the industry as well as collateral from industry-leading suppliers are used with the permission of those entities. Note: The articles contained within this Digital Library are different than the technical articles that are listed on the Speeding Edge website in that they are comprised of advanced subjects that are extremely pertinent to today’s design challenges.
Speeding Edge Digital Library Articles and Papers
SPEEDING EDGE- December 2nd 2019
1. 5-TP5 High-Speed Signal Path Losses as Relates to Copper Roughness and Dielectrics, DesignCon 2013
2. 1080 vs. 3313- Article on effects of glass weave on impedance – Ritchey
3. A Short Tour Through the PCB Design Flow– Ritchey
4. An Update on Low Loss Laminate Materials- Ritchey
5. Using Twinax to Extend the Performance of Big Iron- Ritchey, Knack
6. ASSEMBLY ISSUES WITH MICROVIAS- Paper on defects that can result from micro vias
7. Bandwidth Requirements for Differential Pairs- Ritchey
8. Bypass Capacitor Placement Guide- Ritchey
9. Comparison of X2Y and 0402 Capacitors in a PDS- Ritchey
10. Considerations When designing a PCB Stackup- Ritchey
11. DECIDING HOW TO ROUTE COMPLEX BIDIRECTIONAL NETS-A paper on how to arrive at the proper routing of complex
nets-.Ritchey
12. Differential Pair Design Guide– A 16-page document covering all of the issues related to lo designing high-speed differential
pairs. Ritchey
13. Design Guide for Four Layer PCBs– Lee Ritchey
14. Design Rules for a Typical 14 Layer PCB– Ritchey
15. Designing a PCB Stackup- Ritchey
16. Designing a Power Delivery Subsystem-A 16 page treatment of this topic, Ritchey
17. Differential Skew Presentation- Ritchey
18. Design Guide for Differential Pairs- Ritchey
19. Does A Differential Pair Require 100 Ohm Diff Impedance?- Ritchey 2019
20. EMI and Flat Panel Displays– A discussion of where EMI comes from with LCD displays, Ritchey
21. Effect of Turning Vias on Bandwidth- Ritchey
22. Explanation of Blind and Buried Vias- Ritchey
23. Fabrication_Notes_for High Tg_FR4 PCB- A set of fabrication notes for typical Hi Tg FR4 PCBs. Ritchey
24. Fabrication Notes for PCBs with 10G and Higher Signals- Ritchey
25. Fanout of a 1 mm Pitch BGA for Optimum Routability- Ritchey
26. FAQ How to Determine DC-DC Converter Inductance- Ritchey
27. FAQ Back Drilling- An article describing back drilling of vias, Ritchey
28. FAQ Cross Hatch Planes-An article describing the origin of cross-hatched planes, Ritchey
29. FAQ Designing Thermal Ties- Ritchey
30. FAQ Die Shrinks- An article explaining how IC die shrinks affect signal integrity, Ritchey
31. FAQ Ferrite Beads- An article explaining why the use of ferrite beads crept into designs and whether or not they are a good
solution to noise problems, Ritchey
32. FAQ Is .063″ a Standard PCB Thickness?- An explanation of how this thickness came into existence, Ritchey
33. FAQ Location of AC Caps- An article dealing with the location of AC coupling capacitors in diff pairs, Ritchey
34. FAQ Nonfunctional pads-An article on what these are and whether or not they are needed, Ritchey
35. FAQ Via Conductivity- An analysis of the current carrying capacity of vias, Ritchey
36. FAQ Vias as Stubs-An article on when or if vias act as stubs, Ritchey
37. FAQ Why is PCI Bus 65 Ohms?- An article explaining how this impedance came to be and whether or not it is necessary,
Ritchey
38. FAQ- What is RoHS? Ritchey
39. FAQ- Where Should Test Points Be Connected?- Ritchey
40. FAQ- Why Not Two Traces Between 1 mm Pitch BGA Pins?- Ritchey
41. FAQ- How to Route to 0.8 mm Pitch BGAs?- Ritchey
42. FAQ- Why Do Ferrite Beads Show Un in Applications Notes?- Ritchey
43. How Many Thermal Ties are Required ·to Connect a Power Pin?- Ritchey
44. How to Hook Up Scope Probes.- Ritchey
45. How to Minimize Glass Weave Induced Skew in Differential Pairs.– Ritchey
46. IC Output Testing- Ritchey
47. Is Tight or Loose Coupling Best for Differential Signaling? Ritchey 2019
48. Low Loss vs High Loss Decoupling Capacitors- Ritchey
49. Measuring Loss Tangent in Laminates- Ritchey
50. Minimizing Skew in Very High-Speed Differential Pairs- Lee Ritchey
51. New Glass Weaves for Laminates- Ritchey
52. On The Use of Low DK Laminates in High-Speed Differential Pairs- Lee Ritchey
53. Pad Stack Design Guidelines- Ritchey
54. PCB Surface Finishes- Ritchey
55. PCB Test Structures – Ritchey
56. PON Z vs F Test Procedure- Ritchey
57. Power Subsystem Tests- Ritchey
58. Preemphasis vs Demphasis- Ritchey
59. Resolving EMI Problems with Good PDS Design- Ritchey
60. Routing 10G Signals for Maximum Fidelity– Ritchey
61. Series Capacitor Mounting Structure Tests (Antipads)- Zasio
62. Series Terminated Transmission Switching Operation- Ritchey Good explanation of the operation
63. Speeding Edge Ground Article- Ritchey, Knack 2016
64. Test Procedure for New PCB Designs- Ritchey
65. Test Structures for PCBs– Ritchey
66. Types of Decoupling Capacitor Dielectrics- Ritchey
67. Two Common PCB Design Problems- Ritchey
68. Update on High-Speed Laminates- Ritchey
69. What a Difference a Differential Pair Makes- Ritchey
70. What is Build UP Fabrication? Ritchey
71. What is EMI– Ritchey
72. What is Thieving- Ritchey
73. What Size Bypass Capacitor Package to Choose- Ritchey
74. Where do Return Currents Flow? Ritchey
