Related Articles

List of Reference Papers and Articles in Lee Ritchey’s Archive
some copes are available on request!

Articles by Other Authors Author Date
When bad packages kill good pc boards Richard Goering 12’04
Comparison of X2Y vs 0402 Capacitors for Decoupling John Zazio 6’03
What You Lose From a Lossy Line Dr. Eric Bogatin 3’03
What is Characteristic Impedance? Dr. Eric Bogatin 1’00
What Really is Inductance? Dr. Eric Bogatin 3’00
Partitioning and Layout of a Mixed Signal PCB,  PC Design Henry Ott 6’01
High End Digital Systems Give a Thumbs Down to Rules of Thumb Michael C. Grimes 6’00
Power Distribution System Design Methodology and Capacitor Selection for Modern CMOS Technology, IEEE Press.Smith et al
High Speed Digital System Design Hall, Hall, McCall, Wiley 2000
High-Speed Design’s Ratchet Man Goering 12/98
The Ultimate Board, A Study of Laser Vias vs. Build Up Smedley et al 5’98
Understanding Surface Finishes Prasad 5/98
Electrical Characteristics of HS TLs with Various Diel Montgomery 4’98
Take the Mystery out of AC Termination Nemek 9’97
Incorporating BGAs into High Volume Operations Partridge 8’97
Primer on High Performance Laminates with Cost and Property Neusch 6’97
High Performance Connectors – Gnr to Signal Problems Modinger et al 2’97
High Performance Connectors – The Weak Link Modinger et al 2’97
Permittivity/Dielectric Constant: Do the Math Neves 11’96
Controlling Impedance and the TDR Neves 9’96
Selecting the Appropriate Test Pattern for Fab Defect Rhodes 9’96
Test Your Spread Spectrum Products Schwarts 8’96
Table of PCB Tolerances Multek 1’95
Effects of 20H Rule and Shielding Vias on Electromagnetic Radiation on Printed Circuit Boards Chen and Fang
90 Degree Corners, the Final Turn Brooks 1’98
Base Materials for High Speed, High Frequency PC Boards Rick Hartley 3’02
PCB Trace Evaluation Methods Marcus Simons, YIG Engineering 3’03
90 Degree Corners, The Final Turn” by Doug Brooks of Ultracad, 1998 Doug Brooks of Ultracad 1998

Current Source Articles-Order Now!

Newsletter Volume 1 Issue No. 1

What a Difference a Signal Makes ‘ A detailed treatment of differential signaling
Material Evidence ‘ A discussion of how to select the correct PCB material for each application
Frequently Asked Question- Where Should Decoupling Capacitors be Placed and How Many are Needed?
Frequently Asked Question ‘ Should Nonfunctional Pads be Removed From PCB Artwork?
Frequently Asked Question ‘ How Many Thermal Ties Are Needed to Connect a Power Pin to a Power Plane?

Newsletter Volume 1 Issue No. 2

Test Structures Needed for Multilayer PCBs
Considerations When Designing a Stack up for a Multilayer PCB
Frequently Asked Question – What Size Capacaitor Packages Should I Choose for My Design?
Frequently Asked Question – Should Low Loss or High Loss Capacitors be Used?
Frequently Asked Question – What Type of Insulating Material Should I Use for My Ceramic Decoupling capacitors?

Newsletter Volume 1 Issue No. 3

What is EMI, Where Does It Come From and How Can It Be Controlled?
Pad Stack Design and Power Plane Design
Frequently Asked Question – Do Vias Act as Stubs?
Frequently Asked Question – What is Back Drilling and When Should It Be Done?

Newsletter Volume 1 Issue No. 4

Comparison of X2Y vs. 0402 Capacitors for Decoupling
How do return Currents Find Their Way From Plane to Plane When a Signal Changes Layers?
PCB Surface Finishes
Frequently Asked Question – Why Do Ferrite Beads Show Up in Applications Notes?

Newsletter Volume 2 Issue No. 1 – coming soon!

Should IC Outputs Be Tested With Capacitive Loads or How Do IC Data Sheets Need to Change?
How Should Test Points Be Connected to High Speed Nets?
Frequently Asked Question- How is Parasitic Inductance of a DC-Dc Converter or Capacitor Measured?
Frequently Asked Question- How Can an Oscillloscope Probe be Grounded to an All Surface Mount PCB?

List of Reference Papers and Articles in Lee Ritchey’s Archive
some copes are available on request!