Event: : New Speeding Edge Two-Day Course Offering: One Day PDS Course Followed by One Day PCB Stackup Course
Date: November 6-7, 2012
Location: Brookstreet Hotel
525 Leggett Drive
Ottawa, OntarioCourse Information:
This new, two-day course offering is the perfect, advanced training for those students who have previously taken the two-day Speeding Edge High Speed Signal Integrity and System Design Course although there are no course prerequisites. This course is also excellent for anyone encountering PDS and stackup issues in their current design environments.
Why Take These Courses:
PDS Course
With the ever increasing complexity of ICs and their increasing current demands at the same time the operating voltages have dropped, often to below one volt, it is not possible to guess at the PDS design parameters or rely on old cookbook methods to achieve stable, reliable PDS designs. To ensure the power needs of today’s ICs are met over all operating conditions requires a great deal of discipline and engineering effort . This course has been designed to provide engineers with the information on how to design a PDS right the first time with methodologies and tools that are readily available and easy-to-use.
Topics Addressed
- A complete treatment of the various capacitor choices including their flaws and benefits.
- A complete treatment of the on-PCB, on-package and on-die PDS issues that are required by today's complex, high-speed ASICs.
- How to determine what loads look like.
- Testing of the PDS to ensure proper operation in the completed PCB.
This course is taught by Speeding Edge Founder and President Lee Ritchey who is considered to be one of the industry’s premier authorities on the design and manufacture of high-speed PCB systems.
PCB Stackup Design—Balancing Signal Integrity Against Manufacturability
Once the PDS has been successfully designed and tested, the next step to creating a PCB that works right the first time is to develop the proper PCB Stackup Design. This course provides a detailed treatment of the fabrication process, materials available to manufacture PCBs and a thorough treatment of all the issues encountered when handling multi-gigabit signal protocols. The objective of this course is to guide the design engineer through the process of evaluating and selecting the right laminate for any given design and then designing a PCB stackup that meets the numerous requirements of a complex, multilayer board that works right the first time.
Topics Addressed—Isola Group, http://www.isola-group.com
.The first portion of this class consists of a one-hour session conducted by Isola Group.
Topics that will be addressed include:
- The building blocks available for core and prepreg materials.
- The impact of material selection.
- An overview of available materials.
- What designers should be looking for during the evaluation and selection process.
The second portion of the class is conducted by Lee Ritchey. The fast data paths that are pervasive in all PCB products being currently designed make it imperative to be able to design stackups that have predictable and repeatable impedances.
Topics Addressed—Speeding Edge
- Accounting for copper roughness and its affect on overall signal loss.
- Specifying copper roughness to ensure repeatable loss from lot to lot and fabricator to fabricator.
- Specifying glass weave styles to minimize differential skew.
- Determining plane copper thickness to ensure power delivery needs are met.
- Specifying dielectric materials that are readily available and economical to manufacture.
A complete description of both courses is available under Training Courses
Who Should Take These Courses
- Design engineers
- System architects
- EMC specialists
- Signal integrity engineers
- Technicians
- PCB layout professionals
- Applications engineers
- IC designers
- IC package designers
- Test engineers
- Project engineers
- Design managers
- Engineering managers
Materials Provided with These Courses:
- 3-ring binder containing all presentation slides used in class
- Signed course certificate
- Copy of Right the First Time Volume 1 Book on CD-ROM
- Continental breakfast and lunch and snacks
Polar Instruments, http://www.polarinstruments.com
High speed signaling requires stack up design to take into account a wide variety of requirements including power distribution, impedance, transmission line losses, S-parameters, RLGC for accurate Spice modeling and more. These complexities of design require careful modeling of transmission lines, and the ability to adjust materials and dimensions in order to achieve target performance parameters and also accurately document a stack up from design through to the supply chain. With the foregoing issues in mind, Polar Instruments will provide a brief overview of stack-up related issues including
- Stackup basics outlined in “virtual” materials
- Switching to real materials
- Obtaining post-press dimensions with real materials
- Adding transmission lines to the finished stackup
- Assessing transmission line performance for signal integrity
- Modifying the stackup design to tweak transmission line SI performance
- Supply chain management
NOTE: Each attendee will receive a fully-featured one month activation of Polar Speedstack applications to make use of the knowledge gained in class.
Special Offer from Polar Instruments:
Purchase a Polar license by May 2013, and receive 100% refund of class fees applied to Polar’s invoice.
Costs:
One Day PDS Course: $600.00
One Day PCB Stack-up Design Course: $600.00
Special Offer: SIGN UP FOR BOTH COURSES AND RECEIVE A $100 DISCOUNT OR $1,100 FOR BOTH DAYS! TO REGISTER FOR THESE COURSES, CLICK HERE.
Course registration can be done at www.speedingedge.com. If you have questions or require additional information, please contact Speeding Edge at 707-568-3983 or send an e-mail to kjspeedingedge@cs.com
Accommodations are not included in the course fee. For room reservations,please contact the hotel directly at 613-271-1800.
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